OpenClaw CoWoS Demo

TPU v8 CoWoS Reliability Visualization

This demo translates a CoWoS material-risk simulation into a package-level visual report. The focus pair is TGV Cu Fill against a glass core substrate under a high-power TPU v8 thermal cycle.

Focus PairTGV Cu Fill vs Glass Core
Condition2800W, Delta T 140C
Failure HypothesisEdge shear / TGV interface

Package Cross-Section

Simulation Focus TGV Cu Fill
against
Glass Core Substrate

Highest concern localizes near high-DNP edge zones where lateral shear accumulates fastest.

Cold Plate / Thermal Solution
Silicon Die / Active Stack
Glass Core / Substrate Domain
Edge TGV / Bump Interface
OpenClaw Strong Inference: global warpage is not the only threat. The primary failure hypothesis localizes to the package perimeter where DNP is maximal and CTE-driven shear is amplified.

Stress Gradient Map

Risk
Critical
Readiness
18/100
Delta CTE
13.3
Cycles to Failure
1450
Stress
22.4 MPa
Warpage @25C
245

Glass / Interface Findings

  • TGV Cu Fill: challenging compatibility, score 41.
  • BT/ABF Organic Substrate: conditional compatibility, score 68.
  • Primary interpretation: center zones mostly see Z-axis compression, while outer edge zones absorb radial shear and become the first candidate for fatigue or crack initiation.

Telemetry Snapshot

{
  "focus_pair": ["TGV Cu Fill", "Glass Core Substrate"],
  "test_condition": "TPU v8 thermal cycle 2800W / Delta T 140C",
  "risk": {
    "deltaCTE": 13.3,
    "thermalStrain": 0.1862,
    "risk": "CRITICAL",
    "Nf": 1450,
    "riskScore": 95
  },
  "fea": {
    "max_stress_mpa": 22.4,
    "warpage_25": 245,
    "warpage_260": 24.5,
    "shape_25": "Smile",
    "shape_260": "Smile"
  }
}